Company news
Wei lai da electronics co., LTD. Kedasemi first agent
深圳市伟莱达电子有限公司 | Date:2019/6/28 | View:797
Keda semiconductor co., LTD., founded in October 2007, is located in dongying economic development zone, shandong province, with a registered capital of 50 million yuan. It is a sino-foreign joint venture jointly invested by keda group (stock code: 600986) and STP technology corporation of the United States.
The company mainly designs, produces and sells IGBT, MOSFET, FRD, power management devices and other power semiconductor products.

The company has established a perfect power semiconductor test laboratory and reliability laboratory, and has a large number of world-leading static and dynamic parameter test and reliability test equipment for chips and devices, which are at the leading level in China in terms of equipment level and testing ability.
In terms of static parameter testing, the maximum voltage testing capacity can reach 2000V and the maximum current testing capacity can reach 200A;
Dynamic performance testing, we have a full set of Japan TESEC original dynamic parameters testing system, can complete all the dynamic parameters testing;
The reliability laboratory can meet all the conventional reliability test requirements of power devices.
In addition to meeting the testing requirements of the company's products, the testing laboratory can provide external testing services.

The company has built a first-class ultra-thin wafer back processing plant in dongying city, shandong province, specializing in power semiconductor wafer thinning, etching, back metallization and ion implantation.
The factory can provide professional OEM services.

In June 2010, the packaging and testing factory started construction, and the first phase of the project was put into production in January 2011, mainly for the packaging of IGBT, MOSFET, triode, diode and other power devices, in the form of TO220, TO247, TO3P and so on.
The second phase of the project is scheduled to start in June 2011, mainly engaged in the packaging and testing of ultra-thin patch series of integrated circuits, DFN, QFN and other forms.
With OEM as the main operation mode, the packaging factory provides professional semiconductor packaging and testing services to customers all over the world.